Wafer bonding is through chemical and physical effects of the two have mirror polished homogeneous or heterogeneous wafers closely together, after the wafer bonding, the interface of the atoms under the action of external forces to react to form a covalent bond bond into one, and make the interface to achieve a specific bond strength.

This report contains market size and forecasts of Wafer Bonder in Germany, including the following market information:

Germany Wafer Bonder Market Revenue, 2015-2020, 2021-2026, ($ millions)

Germany Wafer Bonder Market Consumption, 2015-2020, 2021-2026, (Unit)

Germany Wafer Bonder Production Capacity, 2015-2020, 2021-2026, (Unit)

Top Five Competitors in Germany Wafer Bonder Market 2019 (%)

The global Wafer Bonder market was valued at 119.9 million in 2019 and is projected to reach US$ 159.4 million by 2026, at a CAGR of 7.4% during the forecast period. While the Wafer Bonder market size in Germany was US$ XX million in 2019, and it is expected to reach US$ XX million by the end of 2026, with a CAGR of XX% during 2020-2026.

MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Wafer Bonder manufacturers, suppliers, distributors and industry experts on the impacts of the COVID-19 pandemic on businesses, with top challenges including ingredients and raw material delays, component and packaging shortages, reduced/cancelled orders from clients and consumers, and closures of production lines in some impacted areas.

This report also analyses and evaluates the COVID-19 impact on Wafer Bonder production and consumption in Germany


Total Market by Segment:

Germany Wafer Bonder Market, By Type, 2015-2020, 2021-2026 ($ millions) & (Unit)

Germany Wafer Bonder Market Segment Percentages, By Type, 2019 (%)

Semi-Automated Wafer Bonder

Automated Wafer Bonder

Semi-automated wafer bonder is the major type, accounted for 76.27% market share in 2019.

Germany Wafer Bonder Market, By Application, 2015-2020, 2021-2026 ($ millions) & (Unit)

Germany Wafer Bonder Market Segment Percentages, By Application, 2019 (%)

MEMS

Advanced Packaging

CMOS

Others

In the downstream market, wafer bonding can be widely used in MEMS, advanced packaging, CMOS and other industries.Among them, MEMS market is the largest market, accounting for 35.49% of the market.Advanced packaging is the second largest market with 30.97%, while CMOS and other applications occupy a smaller market.


Competitor Analysis

The report also provides analysis of leading market participants including:

Total Wafer Bonder Market Competitors Revenues in Germany, by Players 2015-2020 (Estimated), ($ millions)

Total Wafer Bonder Market Competitors Revenues Share in Germany, by Players 2019 (%)

Total Germany Wafer Bonder Market Competitors Sales, by Players 2015-2020 (Estimated), (Unit)

Total Germany Wafer Bonder Market Competitors Sales Market Share by Players 2019 ($ millions)


Further, the report presents profiles of competitors in the market, including the following:

EV Group

SUSS MicroTec

Tokyo Electron

AML

Mitsubishi

Ayumi Industry