Chip-on-Flex is experiencing a fast growth across the globe. Chip-on-Flex is a kind of COB or Chip-on-Board process technology. The fundamental of chip-on-board process technology includes attaching a chip or a die in a place and a wire bonding it straight to the substrate metallization. The process is affordable and also significantly improves footprint efficiency and lead time. Chip-on-Flex held with shorter interconnection paths simplifies the process of manufacturing and designing of the product and also thereby improves its performance. The rising need for flexible electronics in different applications such as sensors, displays, radio frequency identification and biomedical implants are the major factors driving the growth of chip-on-flex market.