Scope of the Report
The report titled “Global Wafer Fabrication Equipment Market: Size, Trends & Forecasts (2016-2020)” deliver a detailed analysis of the of the global wafer fabrication equipment market with comprehensive analysis of market sizing and growth and market share analysis. It analyzes market by value and segments. An analysis of market share by nodes size has also been provided with forecasted values.
Furthermore, the report also assesses the key opportunities available in the market and summarizes the dynamic forces that are and will be accountable for growth of the industry. Growth of the global wafer fabrication equipment market has also been forecasted for the period 2016-2020, taking into consideration previous growth patterns, growth drivers and the existing and forthcoming trends.
The report provides comprehensive view on the wafer fabrication equipment industry with detailed competitive scenario. Applied materials and ASML Holdings are expected to lead the market in the forecasted period.
A brief company profiling of Applied Materials, ASML Holdings, Lam Research Corporation and KLA Tencor has provided in the report. This section briefs about business overview, financial summary and business policies of these major companies.
Lam Research Corporation
A thin piece of semiconductor material, usually made up of silicon, in the form of a very thin disc that act as a base for fabricating electronic integrated circuits (ICs) and silicon-based photovoltaic cells. A wafer is also known as slice or substrate.
The wafer functions as the substrate for electronic circuits and goes through many processes. The process which is used in the production of photonic and electronic circuits which include radio frequency, amplifiers and other optical components is known as wafer fabrication. The process is primarily done for processing of raw wafers into finished chips. Wafer fabrication process is used to create circuits for a large number of electronic and electrical devices. Wafer fabrication involves four major steps/processes ranging from deposition, removal, patterning to modification of electrical properties.
The global wafer fabrication equipment market has shown rising trends over the past few years and is expected that the market would rise in the next four years i.e. 2016 to 2020. Key factors behind the growth of the market are technology inflection in semiconductor manufacturing, technological advancement in telecom sector, growing demand of compact electronic devices, growing significance of automotive electronics, etc.
Other factors such as rising demand for silicon wafers, growing use of integrated circuits in medical device electronics and innovation in wafer technologies would help in growth of the wafer fabrication equipment market in future. However, there are certain factors posing challenges before the market, such as volume production facility right from the starting, huge investment and requirement of very specific raw materials.