Introduction
Chip on flex (COF) refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically connected to a flexible circuit board. Increase in need for small & flexible electronic devices and rapid technological progression for improving accuracy are the major growth factors for the chip on flex market. Application in wearable electronics, and mobile smartphones shall also provide ample growth opportunities for this market. The global chip on flex market is expected to grow from USD 1.44 Billion in 2016 to USD 1.8 Billion by 2021.

The global chip on flex market is segmented on the basis of type, and application. Market categorization on the basis of type includes one sided chip on flex, and others. One sided chip type segment dominated the market with 85.5% share in 2015. Market segmentation based on application includes sub-segments military, medical, aerospace, electronics, and others. Electronic and medical application segments together contributed around 75% of the total market, in 2015. Regional market segmentation includes sub-segments Asia-Pacific, North America, Europe, and Rest of the World.

Study Objectives

  • To provide insights about factors influencing and affecting the market growth
  • To provide historical and forecast revenue of the market segments as well as sub-segments with respect to regional markets and their key countries
  • To provide historical and forecast revenue of the market segments based on type, and application
  • To provide strategic profiling of key players in the market, comprehensively analyzing their market share, core competencies, and drawing a competitive landscape for the market

Key Players
The key players of global chip on flex market report are LGIT Corporation (U.S.), Stemco Ltd. (Korea), Flexceed Co. Ltd. (Japan), Chipbond Technology Corporation (Taiwan), CWE materials, Inc.(Taiwan), Danbond Technology Co. Ltd.(China), AKM Industrial Co. Ltd. (China), Compass Technology Company Limited (China), Compunetics Inc. (U.S.), and Stars Microelectronics Company Ltd (Thailand). Leading companies in this market are majorly adopting innovation as well as capability expansion to enhance their market share. Strong focus on research and development activities has widened the scope of application for this technology.

Target Audience

  • COF manufactures
  • Government institutions
  • Industries such as aerospace, automotive, IT, industrial, and medical, among others
  • Research Institutions
  • Adhesive Manufacturers
  • Conductor and insulator manufacturers

Regional Analysis
Europe is expected to exhibit the highest growth rate followed by Asia-Pacific, during the forecast period. Europe is projected to offer high growth opportunities to the market, following increasing adoption of COF technology within the automobile industry. Many well established firms such as AKM Industrial Company Ltd., and Compunetics Inc. are increasing their geographic presence in the Europe region, which is indicative of the high growth expectation from this market. Chip on flex market in China is projected to grow from an estimated USD 69.70 million in 2016 to USD 85.53 million by 2021.

The reports also covers country level analysis:

  • North America
  • ·U.S.
  • ·Canada
  • Europe
  • ·Germany
  • ·U.K.
  • ·France
  • ·Rest of Europe
  • Asia-Pacific
  • ·China
  • ·Japan
  • ·Korea
  • ·Taiwan
  • ·Rest of Asia-Pacific
  • Rest of the World