Table of Content

1 INTRODUCTION
1.1 Study Deliverables
1.2 Study Assumptions
1.3 Scope of the Study


2 RESEARCH METHODOLOGY


3 EXECUTIVE SUMMARY


4 MARKET DYNAMICS
4.1 Market Overview
4.2 Introduction to Market Drivers and Restraints
4.3 Market Drivers
4.3.1 Electric Vehicle and Hybrid Electric Vehicle to Drive the Automotive Power Module Packaging
4.3.2 Growing Demand Energy Efficient Battery Powered Devices.
4.3.3 Increasing Stringency of Emission Standards
4.4 Market Restraints
4.4.1 Lack of Standard Protocols for the Development of Power Modules
4.4.2 Slow Adoption of New Technologies Derailing Innovation
4.5 Industry Value Chain Analysis
4.6 Industry Attractiveness - Porter’s Five Force Analysis
4.6.1 Bargaining Power of Buyers/Consumers
4.6.2 Bargaining Power of Suppliers
4.6.3 Threat of New Entrants
4.6.4 Threat of Substitute Products
4.6.5 Intensity of Competitive Rivalry
4.7 Technology Snapshot


5 MARKET SEGMENTATION
5.1 By Type
5.1.1 Intelligent Power Module (IPM)
5.1.2 SiC Module
5.1.3 GaN Module
5.1.4 Others (IGBT,FET)
5.2 Geography
5.2.1 North America
5.2.2 Europe
5.2.3 Asia-Pacific
5.2.4 Rest of the World


6 COMPETITIVE LANDSCAPE
6.1 Amkor Technology
6.2 Kulicke and Soffa Industries Inc.
6.3 PTI Technology Inc.
6.4 Infineon Technologies
6.5 STMicroelectronics
6.6 Fuji Electric Co. Ltd.
6.7 Toshiba Electronic Device & Storage Corporation
6.8 Semikron
6.9 STATS ChipPAC Ltd. (JCET)
6.10 Starpower Semiconductor Ltd.


7 INVESTMENT ANALYSIS


8 MARKET OPPORTUNITIES AND FUTURE TRENDS