Chapter 1: INTRODUCTION

1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS FOR STAKEHOLDERS
1.3. RESEARCH METHODOLOGY

1.3.1. Secondary research
1.3.2. Primary research
1.3.3. Analyst tools & models

Chapter 2: EXECUTIVE SUMMARY

2.1. CXO PERSPECTIVE

Chapter 3: MARKET OVERVIEW

3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS

3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.2.3. Top Winning Strategies

3.3. PORTER’S FIVE FORCES ANALYSIS
3.4. MARKET SHARE ANALYSIS, 2017
3.5. MARKET DYNAMICS

3.5.1. Drivers

3.5.1.1. Low power requirement
3.5.1.2. Reduced system cost

3.5.2. Restraint

3.5.2.1. Designing complexities

3.5.3. Opportunities

3.5.3.1. Adoption in high-end applications

Chapter 4: EMBEDDED FPGA MARKET, BY TECHNOLOGY

4.1. OVERVIEW
4.2. EEPROM

4.2.1. Key market trends and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis by country

4.3. ANTIFUSE

4.3.1. Key market trends and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis by country

4.4. SRAM

4.4.1. Key market trends and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market analysis by country

4.5. FLASH

4.5.1. Key market trends and opportunities
4.5.2. Market size and forecast, by region
4.5.3. Market analysis by country

4.6. OTHERS

4.6.1. Key market trends and opportunities
4.6.2. Market size and forecast, by region
4.6.3. Market analysis by country

Chapter 5: GLOBAL EMBEDDED FPGA MARKET, BY APPLICATION

5.1. OVERVIEW
5.2. DATA PROCESSING

5.2.1. Key market trends and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis by country

5.3. CONSUMER ELECTRONICS

5.3.1. Key market trends and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis by country

5.4. INDUSTRIAL

5.4.1. Key market trends and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis by country

5.5. MILITARY & AEROSPACE

5.5.1. Key market trends and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis by country

5.6. AUTOMOTIVE

5.6.1. Key market trends and opportunities
5.6.2. Market size and forecast, by region
5.6.3. Market analysis by country

5.7. TELECOM

5.7.1. Key market trends and opportunities
5.7.2. Market size and forecast, by region
5.7.3. Market analysis by country

5.8. OTHERS

5.8.1. Key market trends and opportunities
5.8.2. Market size and forecast, by region
5.8.3. Market analysis by country

Chapter 6: GLOBAL EMBEDDED FPGA MARKET, BY REGION

6.1. OVERVIEW
6.2. NORTH AMERICA

6.2.1. Key market trends and opportunities
6.2.2. Market size and forecast, by technology
6.2.3. Market size and forecast, by application
6.2.4. Market analysis by country

6.2.4.1. U.S.

6.2.4.1.1. Market size and forecast, by technology
6.2.4.1.2. Market size and forecast, by application

6.2.4.2. Canada

6.2.4.2.1. Market size and forecast, by technology
6.2.4.2.2. Market size and forecast, by application

6.2.4.3. Mexico

6.2.4.3.1. Market size and forecast, by technology
6.2.4.3.2. Market size and forecast, by application

6.3. EUROPE

6.3.1. Key market trends and growth factors & opportunities
6.3.2. Market size and forecast, by technology
6.3.3. Market size and forecast, by application
6.3.4. Market size and forecast, by country

6.3.4.1. UK

6.3.4.1.1. Market size and forecast, by technology
6.3.4.1.2. Market size and forecast, by application

6.3.4.2. Germany

6.3.4.2.1. Market size and forecast, by technology
6.3.4.2.2. Market size and forecast, by application

6.3.4.3. France

6.3.4.3.1. Market size and forecast, by technology
6.3.4.3.2. Market size and forecast, by application

6.3.4.4. Rest of Europe

6.3.4.4.1. Market size and forecast, by technology
6.3.4.4.2. Market size and forecast, by application

6.4. ASIA-PACIFIC

6.4.1. Key market trends and opportunities
6.4.2. Market size and forecast, by technology
6.4.3. Market size and forecast, by application
6.4.4. Market analysis by country

6.4.4.1. China

6.4.4.1.1. Market size and forecast, by technology
6.4.4.1.2. Market size and forecast, by application

6.4.4.2. India

6.4.4.2.1. Market size and forecast, by technology
6.4.4.2.2. Market size and forecast, by application

6.4.4.3. Japan

6.4.4.3.1. Market size and forecast, by technology
6.4.4.3.2. Market size and forecast, by application

6.4.4.4. Rest of Asia-Pacific

6.4.4.4.1. Market size and forecast, by technology
6.4.4.4.2. Market size and forecast, by application

6.5. LAMEA

6.5.1. Key market trends and key growth factors & opportunities
6.5.2. Market size and forecast, by technology
6.5.3. Market size and forecast, by application
6.5.4. Market analysis by sub-region

6.5.4.1. Latin America

6.5.4.1.1. Market size and forecast, by technology
6.5.4.1.2. Market size and forecast, by application

6.5.4.2. Middle East

6.5.4.2.1. Market size and forecast, by technology
6.5.4.2.2. Market size and forecast, by application

6.5.4.3. Africa

6.5.4.3.1. Market size and forecast, by technology
6.5.4.3.2. Market size and forecast, by application

Chapter 7: COMPANY PROFILES

7.1. INTEL CORPORATION

7.1.1. Company overview
7.1.2. Company snapshot
7.1.3. Operating business segments
7.1.4. Product portfolio
7.1.5. Business performance
7.1.6. Key strategic moves and developments

7.2. QUALCOMM TECHNOLOGIES

7.2.1. Company overview
7.2.2. Company snapshot
7.2.3. Operating business segments
7.2.4. Product portfolio
7.2.5. Business performance
7.2.6. Key strategic moves and developments

7.3. XILINX CORPORATION

7.3.1. Company overview
7.3.2. Company snapshot
7.3.3. Operating business segments
7.3.4. Product portfolio
7.3.5. Business performance
7.3.6. Key strategic moves and developments

7.4. QUICK LOGIC CORPORATION

7.4.1. Company overview
7.4.2. Company snapshot
7.4.3. Operating business segments
7.4.4. Product portfolio
7.4.5. Business performance
7.4.6. Key strategic moves and developments

7.5. NXP SEMICONDUCTORS

7.5.1. Company overview
7.5.2. Company snapshot
7.5.3. Operating business segments
7.5.4. Product portfolio
7.5.5. Business performance
7.5.6. Key strategic moves and developments

7.6. RENESAS ELECTRONICS CORPORATION

7.6.1. Company overview
7.6.2. Company snapshot
7.6.3. Operating business segments
7.6.4. Product portfolio
7.6.5. Business performance
7.6.6. Key strategic moves and developments

7.7. MICROCHIP TECHNOLOGY

7.7.1. Company overview
7.7.2. Company snapshot
7.7.3. Operating business segments
7.7.4. Product portfolio
7.7.5. Business performance
7.7.6. Key strategic moves and developments

7.8. CYPRESS SEMICONDUCTOR

7.8.1. Company overview
7.8.2. Company snapshot
7.8.3. Operating business segments
7.8.4. Product portfolio
7.8.5. Business performance
7.8.6. Key strategic moves and developments

7.9. BROADCOM LIMITED

7.9.1. Company overview
7.9.2. Company snapshot
7.9.3. Operating business segments
7.9.4. Product portfolio
7.9.5. Business performance
7.9.6. Key strategic moves and developments

7.10. ANALOG DEVICES INC.

7.10.1. Company overview
7.10.2. Company snapshot
7.10.3. Operating business segments
7.10.4. Product portfolio
7.10.5. Business performance
7.10.6. Key strategic moves and developments